Place of Origin: | China |
---|---|
Certification: | ISO9001 |
Minimum Order: | 1pnl |
Price: | Negotation |
Payment Terms: | T/T |
Delivery Time: | 6-10 days |
Packaging Details: | Vacuum package |
Board Type: | 6L FR4 TG170 |
Minimum Line Space: | 0.075mm |
Solder Mask: | Green Solder Mask |
Cu Thickness: | 1OZ |
Maximum Substrate Size: | 24”x32” |
Special technology: | Via In Pads,Resin plugged holes, BGA |
Surface finish: | Immersion gold |
Impedance Control: | ±10% |
Business Type: | Manufacturer |
---|---|
Employee Number: | 300~400 |
Annual Sales: | 500million-1000million |
Supplier`s last login times: within 48 hours |
![]() |
![]() |
![]() |
![]() |
![]() |
![]() |
![]() |
![]() |
![]() |
![]() |
![]() |
![]() |
![]() |
![]() |
![]() |