... from normaltemperature to 350°C within 15 minutes.) Rapidly resume temperature. The temperature of tip can resume quickly while the circuit board or electronic component is soaking. Display the actual temperature value and heating power value at the
... of melting lead-free solder and reaching the setting temperature rapidly heating from normal temperature to 350 within 15 minutes. 2. Rapidly resume temperature. The temperature of tip can resume quickly while the circuit board or electronic component is
...*175W*120H Solder Bath Sizes(mm):110*80*45 Features 1, the tin pot is made of imported titanium material, it can be high temperature-proof, corrosion-proof 2, with touching keyboarde. It is very easy and accuracy to set data 3, all data can be filed for
...Lead-Free Tin Wire Rosin Solid Core Solder Wire For Electrical Soldering Welding Lead free solder tin wire Content Sn99 Ag0.3 Cu0.7 Pb free lead free solder, with rosin core, easy flow, easy soldering,environmental protection. Low melting point The melting point temperature at 218℃, suitable for all soldering tools. Excellent performance High electrical conductivity, good performance for electronics soldering...
...temperature zone lead-free reflow Function Inside the device is a heating circuit that heats air or nitrogen to a high enough temperature and blows it to a circuit board already attached to the component, allowing the solders on both sides of the component to melt and Bond to the motherboard. The advantage of this process is that temperature...
...Soldering Machine ±2℃ Soldering Temperature Hot-bar Soldering Machine Functions: Hot-bar soldering process is commonly known as heating and melting tin welding. In short, hot-bar soldering is to heat two parts with pre coated flux and tin to a temperature sufficient to melt the solder (melting point of lead-free solder...
... Due to the high melting point of lead-free solder, one of the characteristics of the SMT lead-free (HASL) soldering process is the high soldering temperature, which brings about the problem of heat resistance of components. Therefore, when evaluating
... into the SMT reflow oven chamber. After high temperature, the solder paste used for soldering the SMD components is melted by the process of high temperature hot air to form a reflow temperature change, so that the SMD components and The pads on the